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Brand Name : HT
Model Number : HT-RB
Certification : ISO9001:2015&ISO16949
Place of Origin : Henan, China (Mainland)
MOQ : 2
Price : Price can be negotiated
Payment Terms : T/C,T/T
Supply Ability : 300/pcs per month
Delivery Time : 2-3weeks
Packaging Details : Carton Box
Blade Material : Diamond
Finishing : Other
Size : 58
Application : Semicoductor,Ceramic chips
Thickness : 0.25MM
Bond : Resin
Resin bond daimond dicing Blade for wafer semicoductor,ceramic chips
Hongtuo’s HT-RB series resin bond diamond blades are some of the most advanced in diamond grinding technology. They apply a thermosetting resin bond material and inter it with diamond abrasives. This diamond grinding tool features an outstanding flexibility and can greatly improve cutting efficiency.It has become a preferred super abrasive tool for cutting hard, brittle and delicate materials, such as glass and crystalline materials.
Features:
1. Theresin bond diamond dicing blade comes with a great self-sharpening performance, which ensures a consistent sharpness and a high cutting efficiency.
2. Resin bonds are extremely flexible, therefore improving the surface finish quality.
Applications:
This dicing blade is best suited for cutting hard and brittle materials such as quartz and glass.
Specifications
Technical Parameters
| O.D | Thickness | I.D | ||||
| Size | Tolerance | Size | Standard tolerance | High precision tolerance | Size | Tolerance | 
| 50~ 100 | +0.02 | 0.1~≤ 0.15 | ±0.005 | 25.4 30 31.75 40 60 80 88.9 | +0.02~ 0 | |
|   | 
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                     Custom Size Resin Bond Diamond Blades Thickness 0.25MM ISO16949 Approved
                                                                                    
                        
                        
                        
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                     Size 50 - 100 Diamond Dicing Blades , Ceramic Chips Diamond Wafering Blade
                                                                                    
                        
                        
                        
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                     Machine Resin Bond Diamond Blades High Self Sharpening Performance For Glass
                                                                                    
                        
                        
                        
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